Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications

Temporary bonding/debonding (TBDB) technologies have greatly contributed to the reliable fabrication of thin devices. However, rapid development large-scale, high-precision and ultra-thin devices in semiconductor field has also proposed more stringent requirements for TBDB technologies. Here, we deliberate recent progress materials temporary bonding different debonding over past decade. Several common methods are described, including thermal slide, wet chemical dissolution, mechanical peeling laser ablation. We review current status highlight applications advanced electronic packaging. Possible solutions challenges opportunities faced by Ultimately, attempt propose an outlook on their future possible applications. believe that simple schematics refined data presented this would give readers a deep understanding vast application scenarios